RUMOR: Switch successor pictures and specs leak (UPDATE)
We all knew it was a matter of time. Even if Nintendo hasn’t officially shown anything for the Switch successor, we know it’s going to get a reveal any day now. Rumors have been flying of developers heading to Nintendo, production lines cranking the system out, features being leaked, ect.. Now today all of that comes to a head with the first supposed look at the system itself.
The image above supposedly shows off what the Switch successor will look like, and as many have expected, it appears to be extremely similar to the current Switch. Of course, the real changes are to be found inside the system itself, as the hardware’s power will differ greatly from what the first iteration of Switch included.
Here’s a breakdown of supposed specs for the platform:
- SoCl (CPU + GPU) model: GMLX30-R-A1.
- Memory model: MT62F768M64D4EK-026 (6GX2 dual channel, LPDDR5X, 7500 MT/s)
- Flash memory model: THGJFGT1E45BAILHW0 (256GB, UFS 3.1, manufactured by Kaixia, 2100 MB/s).
- Audio chip model: Ruiwu ALC5658-CG.
- NFC reader model: NXP IPN7160B1HN
- Built-in microphone model: CMB-MIC-X7.
- Dual cooling fans, model BSM0405HPJH9 and BSM0505HPJQC (copper gaming heat sink).
- Video signal conversion (DisplayPort to HDMI) must be chip model; Ruixian RTD2175N must be chip (support HDMI 2.1).
- Network chip model: Ruiming RTL8153B-VB-CG and Gigabit Ethernet chip (the base has a network cable interface).
- Microcontroller chip model: STMicroelectronics JSTM32G0OB0OCET6.
- Video game console protective case model: HGU1100 (size: 206 x 115 x 14mm, made of plastic).
- Speakers: MUSE BOX-L and MUSE BOX-R (two-channel stereo).
It’s obviously tough to get confirmation on this sort of thing, but as far as the look of the system goes, a source familiar with Nintendo’s plans has told VGC that the design seen above matches what they’ve been told by Nintendo.
There have also been some renders that have leaked, but those are apparently a bit more dubious in nature. The jury is still out on those being actual renders, so we’ve decided not to include them in the post. You can still find those via the Reddit source link if you’d like to take a look.
As always, please remember that all of this is rumor and speculation until Nintendo confirms details. Hopefully that will be in the very near future!
UPDATE: As we mentioned above, the renders that came out earlier today were a bit questionable. We’ve now seen those renders tracked back to a 3D printing enthusiast. What’s unclear is if they are the same source that provided the pictures you see above. It’s possible the device in those pictures was 3D-printed based off the fan-made renders, but again, we don’t have definitive proof either way at this time.
UPDATE: Yet another round of rumored tech specs have surfaced. We can’t speak to the legitimacy of these figures, so please take them with a grain of salt. Some of this aligns with what we shared earlier above, and some differs.
Technical Specifications:
CPU: Arm Cortex-A78C
- 8 cores
- Unknown L1/L2/L3 cache sizes
GPU @ Nvidia T239 Ampere (RTX 20 series)
- 1 Graphics Processing Cluster (GPC)
- 12 Streaming Multiprocessors (SM)
- 1534 CUDA cores
- 6 Texture Processing Clusters (TPC)
- 48 Gen 3 Tensor cores
- 2 RTX ray-tracing cores
RAM: 12 GB LPDDR5, (some/all units will have LPDDR5X chips)
Power Profiles:
Handheld:
- CPU @ 1100.8 MHz
- GPU @ 561 MHz, 1.72 TFLOPs peak
- RAM @ 2133 MHz, 68.26 GB/s peak bandwidth
Docked:
- CPU @ 998.4 MHz
- GPU @ 1007.3 MHz, 3.09 TFLOPs peak
- RAM @ 3200 MHz, 102.40 GB/s peak bandwidth
For a comparison in terms of TFLOPs, the Xbox Series S clocks in at 4 TFLOPs, while the PS4 Pro is 4.2 TFLOPs. We can also go a step further by showing TFLOP percentage comparison with PS4 and PS5:
PS4
- Docked – 111%
- Handheld – 61%
PS5
- Docked – 21%
- Handheld – 12%
